Recently, the micro-assembly production line of Tianqiong Electronics has successfully completed the installation and trial production, marking an important breakthrough for the company in the industry. The construction of this micro-assembly production line is a strategic and important initiative of the company. The project has taken several months from planning to implementation, and through the joint efforts and unremitting struggles of all the staff, this important moment has finally been ushered in.

During the construction of the production line, the company overcame many technical difficulties and process challenges. With rich experience and innovative spirit, the technical team of the company continuously optimizes the design of the production line and improves the performance of the equipment to ensure the stability and high efficiency of the production line. At the same time, the company also introduced advanced production equipment and technical means to provide a strong guarantee for the smooth operation of the production line.

Up to now, the company has fully completed the construction of the micro-assembly production line, and added a series of micro-assembly equipments such as gold wire bonding machine and precision resistance spot welding machine. At the same time, we have repeatedly organized micro-assembly skills training for relevant production line personnel to effectively improve the professional ability of designers and operators.

The completion and commissioning of the micro-assembly production line will significantly enhance the company's production capacity and competitiveness. In the future, the company will continue to adhere to the innovation-driven, constantly explore the excellent process, and strive to improve the technical level and production efficiency of the production line, so as to provide customers with better quality products and services.

What is “micropackaging”?

Micropackaging technology, short for microelectronic packgingtechnology, is a new generation of advanced electronic assembly technology. It is an advanced hybrid microelectronic technology that assembles highly integrated IC devices and other components on high-density multilayer substrates by means of micro-solder interconnect and micro-packaging technology, constituting a high-density, high-reliability, high-performance, multi-functional three-dimensional structure of microelectronic products.

Micro-assembly of each process technology is as follows:

1. Mounting: the circuit substrate, glass insulator sintered inside the cavity.

Anti-vibration crystal - temperature complementary crystal - SMD crystal - active crystal - Changsha Sky Dome Electronic Technology Co.

2. Soldering: Solder the surface of the surface-mounted components on the surface of the circuit to be soldered.

3. Sticky chip: Bond the chip on the surface of the circuit to be stuck.

4.Bonding: Use heat, pressure, ultrasonic energy to weld the fine metal wire closely with the substrate pad, to realize the electrical interconnection between the chip and the substrate and the information intercommunication between the chips.

5.Testing: Detecting and debugging the electrical performance parameters of the product.

6. Capping: Capping the circuit module to be capped.

About us

Changsha Tianqiong Electronic Technology Company is a professional manufacturer of time and frequency products, dedicated to “providing accurate scale for perceiving the world”, and “SHUTAI” is a registered trademark owned by the company. The company focuses on high-precision frequency signal generation, maintenance and time transfer, not only for human daily life to provide standard time products, but also for high-precision physical measurements, wireless detection and broadband communications to provide frequency reference. Through unremitting efforts, continuous cultivation, research and development of advanced high-quality products, to provide accurate scale for human perception of the world.